SAN JOSE -- Samsung Electronics Co. ga-ebido ọrụ nkwakọ ngwaahịa atọ (3D) maka ebe nchekwa bandwidth dị elu (HBM) n'ime afọ a, a na-atụ anya na a ga-ewebata teknụzụ maka ụdị HBM4 nke ọgbọ nke isii nke chip ọgụgụ isi artificial nke a ga-emepụta na 2025, dịka ụlọ ọrụ ahụ na isi mmalite ụlọ ọrụ si kwuo.
Na Juun 20, ụlọ ọrụ mmepụta chip ebe nchekwa kachasị ukwuu n'ụwa kpughere teknụzụ nkwakọ ngwaahịa chip kachasị ọhụrụ ya na atụmatụ ọrụ na Samsung Foundry Forum 2024 nke emere na San Jose, California.
Ọ bụ nke mbụ Samsung wepụtara teknụzụ nkwakọ ngwaahịa 3D maka ibe HBM n'ememe ọha. Ugbu a, a na-eji teknụzụ 2.5D ekpuchi ibe HBM.
O mere ihe dị ka izu abụọ ka onye guzobere Nvidia na onye isi nchịkwa Jensen Huang kpughere usoro ọgbọ ọhụrụ nke ikpo okwu AI ya bụ Rubin n'oge ọ na-ekwu okwu na Taiwan.
O yikarịrị ka HBM4 ga-abanye na ụdị ọhụrụ Rubin GPU nke Nvidia a na-atụ anya na ọ ga-abata n'ahịa na 2026.
Njikọ kwụ ọtọ
Teknụzụ nkwakọ ngwaahịa kachasị ọhụrụ nke Samsung nwere ibe HBM nke a kpọkọtara n'elu GPU iji mee ka mmụta data na nhazi nkwụsịtụ dịkwuo ngwa ngwa, teknụzụ a na-ewere dị ka ihe na-agbanwe egwuregwu na ahịa chip AI na-eto ngwa ngwa.
Ugbu a, a na-ejikọ ibe HBM na GPU n'usoro na silicon interposer n'okpuru teknụzụ nkwakọ ngwaahịa 2.5D.
Ma e jiri ya tụnyere ya, nkwakọ ngwaahịa 3D anaghị achọ ihe mkpuchi silicon, ma ọ bụ obere ihe dị n'etiti ibe iji mee ka ha nwee ike ikwurịta okwu ma rụọ ọrụ ọnụ. Samsung kpọrọ teknụzụ nkwakọ ngwaahịa ọhụrụ ya SAINT-D, nke a na-akpọ Samsung Advanced Interconnection Technology-D.
ỌRỤ NTỤKỊTA
A ghọtara na ụlọ ọrụ South Korea na-enye nkwakọ ngwaahịa 3D HBM n'ụzọ dị mfe.
Iji mee nke a, ndị otu ha na-eji nkwakọ ngwaahịa eme ihe ga-ejikọ ibe HBM ndị e mepụtara na ngalaba azụmaahịa ebe nchekwa ya na GPU ndị e jikọtara maka ụlọ ọrụ akụkọ ifo site na ngalaba ntọala ya.
"Nkwakọ ngwaahịa 3D na-ebelata oriri ike na igbu oge nhazi, na-eme ka mma nke akara eletriki nke chips semiconductor dịkwuo mma," ka onye ọrụ Samsung Electronics kwuru. Na 2027, Samsung na-eme atụmatụ iwebata teknụzụ njikọta dị iche iche nke na-agụnye ihe anya nke na-eme ka ọsọ nnyefe data nke semiconductors dịkwuo elu n'ime otu ngwugwu nke ngwa ngwa AI.
Dịka TrendForce, ụlọ ọrụ nyocha Taiwan si kwuo, dịka mmụba nke ọchịchọ maka obere ike na arụmọrụ dị elu, a na-atụ anya na HBM ga-emejupụta 30% nke ahịa DRAM na 2025 site na 21% na 2024.
Nnyocha MGI na-ebu amụma na ahịa nkwakọ ngwaahịa dị elu, gụnyere nkwakọ ngwaahịa 3D, ga-eto ruo ijeri $80 site na 2032, ma e jiri ya tụnyere ijeri $34.5 na 2023.
Oge ozi: Juun-10-2024