SAN JOSE - Samsung Electronics Co. ga-ewepụta ọrụ nkwakọ ngwaahịa akụkụ atọ (3D) maka ebe nchekwa bandwidth dị elu (HBM) n'ime afọ, teknụzụ a na-atụ anya ka ewebata maka ụdị ọgụgụ isi nke ọgbọ nke isii HBM4 n'ihi na 2025, dị ka ụlọ ọrụ na ụlọ ọrụ isi mmalite.
Na June 20, onye mgbawa ebe nchekwa kachasị n'ụwa ekpughere teknụzụ nkwakọ ngwaahịa mgbawa kachasị ọhụrụ yana ụzọ ọrụ na Samsung Foundry Forum 2024 emere na San Jose, California.
Ọ bụ nke mbụ Samsung wepụtara teknụzụ nkwakọ ngwaahịa 3D maka ibe HBM na mmemme ọha.Ugbu a, a na-eji teknụzụ 2.5D chịkọta ibe HBM.
Ọ bịara ihe dị ka izu abụọ mgbe Nvidia co-guzobere na Chief Executive Jensen Huang kpughere ọgbọ ọhụrụ nke ụlọ ọrụ AI ya Rubin n'oge okwu na Taiwan.
HBM4 nwere ike itinye n'ime Nvidia ọhụrụ Rubin GPU nlereanya a na-atụ anya na ọ ga-akụ ahịa na 2026.
NKEKWU OKWU
Teknụzụ nkwakọ ngwaahịa Samsung kacha ọhụrụ nwere akara HBM ibe edokọbara kwụ ọtọ n'elu GPU iji mee ka mmụta data na nhazi ntinye dị ngwa ngwa, teknụzụ a na-ewere dị ka onye na-agbanwe egwuregwu n'ahịa mgbawa AI na-eto ngwa ngwa.
Ugbu a, ibe HBM na-ejikọta ya na GPU na ihe ntinye silicon n'okpuru teknụzụ nkwakọ ngwaahịa 2.5D.
N'iji ya tụnyere, nkwakọ ngwaahịa 3D anaghị achọ ihe ntinye silicon, ma ọ bụ ihe dị mkpa nke na-anọdụ n'etiti ibe iji mee ka ha nwee ike ịkparịta ụka na ịrụkọ ọrụ ọnụ.Samsung dubs teknụzụ nkwakọ ngwaahịa ọhụrụ ya dị ka SAINT-D, mkpụmkpụ maka Samsung Advanced Interconnection Technology-D.
Ọrụ atụgharị
Aghọtara ụlọ ọrụ South Korea na-enye nkwakọ ngwaahịa 3D HBM na ndabere ntụgharị.
Iji mee nke a, ndị otu nkwakọ ngwaahịa ya dị elu ga-ejikọta ibe HBM na-emepụta na ngalaba azụmahịa ebe nchekwa ya na GPU gbakọtara maka ụlọ ọrụ na-adịghị mma site na ngalaba ntọala ya.
"Nkwakọ ngwaahịa 3D na-ebelata oriri ike na nhazi oge, na-eme ka ogo ọkụ eletrik nke ibe semiconductor dị," onye ọrụ Samsung Electronics kwuru.Na 2027, Samsung na-ezube iwebata teknụzụ njikọta dị iche iche nke na-etinye ihe anya na-abawanye ọsọ ọsọ data nke semiconductor n'otu ngwugwu AI accelerators.
N'ikwekọ n'ọkwa na-eto eto maka ibe dị ala, nke na-arụ ọrụ dị elu, HBM na-atụ anya ime 30% nke ahịa DRAM na 2025 site na 21% na 2024, ka TrendForce, ụlọ ọrụ nyocha Taiwanese siri kwuo.
Nnyocha MGI buru amụma amụma nkwakọ ngwaahịa dị elu, gụnyere nkwakọ ngwaahịa 3D, ga-eto ruo $ 80 ijeri site na 2032, ma e jiri ya tụnyere ijeri $ 34.5 na 2023.
Oge nzipu: Jun-10-2024