Na Septemba 13, 2024, Resonac kwupụtara owuwu ụlọ mmepụta ọhụrụ maka wafers SiC (silicon carbide) maka semiconductor ike na Yamagata Plant ya dị na Higashine City, Yamagata Prefecture. A na-atụ anya na a ga-emecha ya na nkeji nke atọ nke 2025.
Ụlọ ọrụ ọhụrụ a ga-adị n'ime Yamagata Plant nke ụlọ ọrụ ya, Resonac Hard Disk, ma nwee ebe owuwu nke mita 5,832 square. Ọ ga-emepụta wafers SiC (substrates na epitaxy). Na June 2023, Resonac natara asambodo site na Ministry of Akụnụba, Azụmaahịa na Ụlọ Ọrụ dịka akụkụ nke atụmatụ nkwenye ọkọnọ maka ihe dị mkpa edepụtara n'okpuru Iwu Nkwalite Nchekwa Akụnụba, kpọmkwem maka ihe semiconductor (wafers SiC). Atụmatụ nkwenye ọkọnọ nke Ministry of Akụnụba, Azụmaahịa na Ụlọ Ọrụ kwadoro chọrọ itinye ego nke yen 30.9 ijeri iji mee ka ikike mmepụta wafer SiC sie ike na ntọala ndị dị na Oyama City, Tochigi Prefecture; Hikone City, Shiga Prefecture; Higashine City, Yamagata Prefecture; na Ichihara City, Chiba Prefecture, yana enyemaka ruru yen 10.3 ijeri.
Atụmatụ a bụ ịmalite inye Oyama City, Hikone City, na Higashine City wafers (ihe ndị dị n'ime ala) na Eprel 2027, nke nwere ike imepụta kwa afọ nke iberibe 117,000 (ihe ruru sentimita 6). A na-atụ anya na nnyefe nke wafers epitaxial SiC na Ichihara City na Higashine City ga-amalite na Mee 2027, yana atụmanya na a ga-enwe ike nke iberibe 288,000 kwa afọ (anaghị agbanwe agbanwe).
Na Septemba 12, 2024, ụlọ ọrụ ahụ mere emume dị egwu n'ebe a na-eme atụmatụ iwu ụlọ na Yamagata Plant.
Oge ozi: Sep-16-2024