Na Septemba 13, 2024, Resonac kwupụtara owuwu nke ụlọ nrụpụta ọhụrụ maka SiC (silicon carbide) wafers maka ike semiconductor na Yamagata Plant na Higashine City, Yamagata Prefecture. A na-atụ anya mmecha ahụ na nkeji nke atọ nke 2025.
Ụlọ ọrụ ọhụrụ a ga-adị n'ime Yamagata Plant nke enyemaka ya, Resonac Hard Disk, ma ga-enwe ebe ụlọ nke 5,832 square mita. Ọ ga-emepụta SiC wafers (substrates na epitaxy). Na June 2023, Resonac nwetara asambodo sitere na Ministry of Economy, Trade and Industry dị ka akụkụ nke atụmatụ mmesi obi ike maka ihe ndị dị mkpa edobere n'okpuru Iwu nkwalite nchekwa akụ na ụba, kpọmkwem maka ihe semiconductor (SiC wafers). Atụmatụ mmesi obi ike nke ndị Ministry of Economy, Trade and Industry kwadoro na-achọ itinye ego nke 30.9 ijeri yen iji wusie ike mmepụta nke SiC wafer na ntọala na Oyama City, Tochigi Prefecture; Obodo Hikone, Shiga Prefecture; Obodo Higashine, Mpaghara Yamagata; na Ichihara City, Chiba Prefecture, nwere enyemaka ruru ijeri yen 10.3.
Atumatu a bụ ibido ibubata SiC wafers (substrates) na Oyama City, Hikone City, na Higashine City na Eprel 2027, yana ikike nrụpụta kwa afọ nke iberibe 117,000 (nke dabara na inch 6). A na-atụ anya ịnyefe SiC epitaxial wafers na Ichihara City na Higashine City ga-amalite na Mee 2027, na-atụ anya ike kwa afọ nke 288,000 iberibe (agbanweghi agbanwe).
Na Septemba 12, 2024, ụlọ ọrụ ahụ mere emume mgbawa n'ebe a na-eme atụmatụ owuwu na Yamagata Plant.
Oge nzipu: Sep-16-2024